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  • 光子猝发探测开发模块 NV03TDC‑DEV

  • 光子猝发探测开发模块 NV03TDC‑DEV

    瑞士Novoviz NV03TDC‑DEV是单像素光子猝发探测开发模块，集成片上 TDC，时间戳分辨率 2 ns，片上 FIFO 最多缓存 255 个光子事件；支持外部门控，USB 一线供电与数据读出，无需外部阈值电路。适合荧光寿命测量、弱光成像、深度传感。

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瑞士Novoviz NV03TDC‑DEV是单像素光子猝发探测开发模块，集成片上 TDC，时间戳分辨率 2 ns，片上 FIFO 最多缓存 255 个光子事件；支持外部门控，USB 一线供电与数据读出，无需外部阈值电路。适合荧光寿命测量、弱光成像、深度传感。


光子猝发探测开发模块 NV03TDC‑DEV

NV03TDC-DEV Photon burst detector development module


NovoViz NV03TDC‑DEV 专为需要单点单光子探测以及光子猝发事件时间戳记录的应用而研发。该器件无需外接阈值电路，单根 USB 线缆同时完成供电与数据传输。


这款传感器融合了单光子雪崩二极管（SPAD）像素的优势，具备单光子分辨能力与高速响应特性；同时集成片上时间戳单元与存储器，可实现高事件计数速率并降低数据输出带宽。


其创新架构采用多触发时间数字转换器（TDC），搭配自由运行、可门控的 SPAD 像素。时间分辨率由外部输入时钟信号决定。探测到的光子事件存入片上 FIFO 存储器，用户可随时读取。


应用荧光寿命测量、高动态范围成像、弱光成像、深度传感等场景
特点

  • 像素：单 SPAD 像素

  • 片上存储器：可存储 255 个光子事件

  • 时间戳分辨率：2 ns

  • 支持外部门控信号

白皮书+文章

一、White papers（白皮书）

  1. Noise and stability analysis of an asynchronous SPAD camera operating in space at Low Earth Orbit中文标题：《低地球轨道空间环境下异步 SPAD 相机噪声与稳定性分析》

    下载入口：https://novoviz.com/resources/ （页面内白皮书栏目直接下载 PDF）

  2. Investigation of photon counting statistics in a coherent state by leveraging a SPAD‑based photon number resolver中文标题：《基于 SPAD 光子数分辨模块研究相干态光子计数统计》

    下载链接：https://proceedings.spiedigitallibrary.org/conference-proceedings-of-spie/14078/140780H/Investigation-of-photon-counting-statistics-in-a-coherent-state-by/10.1117/12.3095708.full


二、Scientific papers（学术论文）

  1. Sundar, A. Ardelean, T. Swedish, C. Brusschini, E. Charbon and M. Gupta. SoDaCam: Software‑defined Cameras via Single‑Photon Imaging, 2023 IEEE/CVF International Conference on Computer Vision (ICCV), Paris, France, 2023, pp. 8131‑8142, doi:10.1109/ICCV51070.2023.00750. 链接：https://ieeexplore.ieee.org/document/10378589/

  2. V. Sundar, M. Dutson, A. Ardelean, C. Bruschini, E. Charbon and M. Gupta. Generalized Event Cameras, 2024 IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR), Seattle, WA, USA, 2024, pp. 25007‑25017, doi:10.1109/CVPR52733.2024.02362. 链接：https://ieeexplore.ieee.org/document/10655318

  3. F. Gutierrez‑Barragan et al. Learned Compressive Representations for Single‑Photon 3D Imaging, 2023 IEEE/CVF International Conference on Computer Vision (ICCV), Paris, France, 2023, pp. 10722‑10732, doi:10.1109/ICCV51070.2023.00987. 链接：https://ieeexplore.ieee.org/document/10378448

  4. A. Muntean et al. Blumino: The First Fully Integrated Analog SiPM With On‑Chip Time Conversion, IEEE Transactions on Radiation and Plasma Medical Sciences, vol. 5, no. 5, pp. 671‑678, Sept. 2021, doi:10.1109/TRPMS.2020.3045081. 链接：https://ieeexplore.ieee.org/document/9295406

  5. A. Muntean et al. On‑Chip Fully Reconfigurable Artificial Neural Network in 16 nm FinFET for Positron Emission Tomography, IEEE Journal of Selected Topics in Quantum Electronics, vol. 30, no. 1, Jan.‑Feb. 2024, Art. no. 7600213, doi:10.1109/JSTQE.2023.3346957. 链接：https://ieeexplore.ieee.org/document/10374199

  6. E. Kizilkan et al. Guard‑Ring‑Free InGaAs/InP Single‑Photon Avalanche Diode Based on a Novel One‑Step Zn‑Diffusion Technique, IEEE Journal of Selected Topics in Quantum Electronics, vol. 28, no. 5, Sept.‑Oct. 2022, Art. no. 9300209, doi:10.1109/JSTQE.2022.3162527. 链接：https://ieeexplore.ieee.org/abstract/document/9743206

  7. E. Kizilkan et al. Extended Temperature Modeling of InGaAs/InP SPADs, ESSDERC 2023‑IEEE 53rd European Solid‑State Device Research Conference, Lisbon, Portugal, 2023, pp.140‑143, doi:10.1109/ESSDERC59256.2023.10268545. 链接：https://ieeexplore.ieee.org/abstract/document/10268545